Single board, cabinet and data center
The invention provides a single board, a cabinet and a data center, and the single board comprises a board body which is used for bearing a chip. The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for...
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creator | YAN TAO CHEN JIE LIU QINGYING ZOU HENGLONG |
description | The invention provides a single board, a cabinet and a data center, and the single board comprises a board body which is used for bearing a chip. The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for conveying a working medium. The first heat dissipation pipeline comprises a first pipeline and a second pipeline. The first pipeline and the second pipeline are respectively connected with the input end and the output end of the evaporator in a one-to-one correspondence manner; first quick-pull connectors are arranged at the ends, away from the evaporator, of the first pipeline and the second pipeline respectively; the first pipeline is connected with the input end of the evaporator; and at least the first pipeline is provided with a switch valve. The condenser and the evaporator are quickly plugged and connected through the first quick plug connector, and the condenser can be arranged in the cabinet, so that the h |
format | Patent |
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The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for conveying a working medium. The first heat dissipation pipeline comprises a first pipeline and a second pipeline. The first pipeline and the second pipeline are respectively connected with the input end and the output end of the evaporator in a one-to-one correspondence manner; first quick-pull connectors are arranged at the ends, away from the evaporator, of the first pipeline and the second pipeline respectively; the first pipeline is connected with the input end of the evaporator; and at least the first pipeline is provided with a switch valve. 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The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for conveying a working medium. The first heat dissipation pipeline comprises a first pipeline and a second pipeline. The first pipeline and the second pipeline are respectively connected with the input end and the output end of the evaporator in a one-to-one correspondence manner; first quick-pull connectors are arranged at the ends, away from the evaporator, of the first pipeline and the second pipeline respectively; the first pipeline is connected with the input end of the evaporator; and at least the first pipeline is provided with a switch valve. 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language | chi ; eng |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Single board, cabinet and data center |
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