Single board, cabinet and data center

The invention provides a single board, a cabinet and a data center, and the single board comprises a board body which is used for bearing a chip. The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAN TAO, CHEN JIE, LIU QINGYING, ZOU HENGLONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a single board, a cabinet and a data center, and the single board comprises a board body which is used for bearing a chip. The single plate further comprises an evaporator arranged on the plate body and a first heat dissipation pipeline embedded in the plate body and used for conveying a working medium. The first heat dissipation pipeline comprises a first pipeline and a second pipeline. The first pipeline and the second pipeline are respectively connected with the input end and the output end of the evaporator in a one-to-one correspondence manner; first quick-pull connectors are arranged at the ends, away from the evaporator, of the first pipeline and the second pipeline respectively; the first pipeline is connected with the input end of the evaporator; and at least the first pipeline is provided with a switch valve. The condenser and the evaporator are quickly plugged and connected through the first quick plug connector, and the condenser can be arranged in the cabinet, so that the h