Power device assembly

The invention discloses a power device assembly. The power device assembly comprises a radiator; a metal sheet is arranged at the bottom of the power element; the heat conduction bonding glue layer and the glue points are arranged between the radiator and the metal sheet, the glue points are made of a first material, the heat conduction bonding glue layer is made of a second material, the hardness of the first material after curing is larger than that of the second material after curing, and the glue points are arranged on the radiator. The thickness control module is used for controlling the thickness of the heat-conducting adhesive layer; and one surface of the heat-conducting adhesive layer is adhered to the metal sheet, and the other surface of the heat-conducting adhesive layer is adhered to the radiator. The mounting structure can ensure that the flatness of a mounting surface formed by a plurality of side walls meets the requirement. 本申请公开一种功率器件组件。其中，功率器件组件包括：散热器；功率元件，所述功率元件的底部具有金属片；设置在所述散热器及所述金属片之间的导热