SEMICONDUCTOR DEVICE, OPERATING METHOD THEREOF AND MANUFACTURING METHOD THEREOF
A method of manufacturing a semiconductor device includes forming a semiconductor substrate having a first protected circuit, and forming a first guard ring around the first protected circuit, including: forming a first wall to provide a first reference voltage; and forming a second wall for providi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A method of manufacturing a semiconductor device includes forming a semiconductor substrate having a first protected circuit, and forming a first guard ring around the first protected circuit, including: forming a first wall to provide a first reference voltage; and forming a second wall for providing a second reference voltage different from the first reference voltage. In addition, the invention also discloses a semiconductor device and a method for operating the semiconductor device.
一种半导体装置、其操作方法及其制造方法,制造半导体装置的方法包括形成具有第一受保护电路的半导体基板,及在第一受保护电路周围形成第一保护环,包括:形成用以提供第一参考电压的第一壁;及形成用以提供不同于第一参考电压的第二参考电压的第二壁。此外,一种半导体装置及操作半导体装置的方法亦在此揭露。 |
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