SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The invention discloses a semiconductor device and a method of manufacturing the same. The disclosed method of manufacturing a semiconductor device includes dividing a bonding substrate into a plurality of semiconductor devices, the bonding substrate including a first substrate provided with an interconnection structure layer and a first bonding layer, and a second substrate provided with a second bonding layer opposite the first bonding layer. The bonding substrate includes a functional element region and a scribe region in a plan view. The dividing includes forming a groove in the scribe line region, and cutting the bonding substrate in a region other than an inside surface of the groove. A recess is formed through one of the first substrate and the second substrate, the interconnection structure layer, and the first bonding layer and the second bonding layer. The recess extends from the one of the first substrate and the second substrate to a position deeper than all of the interconnect layers disposed bet