Method of operating semiconductor process system and semiconductor process system

A method of operating a semiconductor process system and a semiconductor process system including a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over a wafer during a semiconductor process. The...

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Bibliographische Detailangaben
Hauptverfasser:	WU SIHUA, LI JINSI, XIE MENGJUN, HUANG XINGYUAN, CAI ZONGYOU, WU ZHICHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of operating a semiconductor process system and a semiconductor process system including a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over a wafer during a semiconductor process. The inner surface of the bell jar is coated with a rough coating. The rough coating may include zirconium. 一种操作半导体工艺系统的方法和半导体工艺系统，包括工艺腔室。工艺腔室包括晶圆支撑件其配置为支撑晶圆。此系统包括钟形罩其配置为在半导体工艺期间位在晶圆上方。钟形罩的内表面以粗糙涂层涂覆。粗糙涂层可以包括锆。