Integrated circuit bonding pad with multi-material tooth-shaped structure

An integrated circuit device may include a multi-material toothed bond pad (306, 406, 770, 940, 1102, 1202) that includes: (a) an array of vertically extending teeth (320, 420, 720, 904, 111, 1204) formed from a first material; and (b) a second material (filler material) (322, 422, 760, 930, 111, 1206) that at least partially fills the voids (724, 906, 1206) between the array of teeth (320, 420, 720, 904, 111, 1204). The teeth (320, 420, 720, 904, 111, 1204) may be formed by depositing and etching the first material, and the fill material (322, 422, 760, 930, 111, 1206) may be deposited on the array of teeth (320, 420, 720, 904, 111, 1204) and extend down into the voids (724, 906, 1206) between the teeth (320, 420, 720, 904, 111, 1204) and etched to expose a top surface of the teeth (320, 420, 720, 904, 111, 1204). The array of teeth (320, 420, 720, 904, 111, 1204) may collectively define an abrasive structure. The multi-material toothed bond pad (306, 406, 770, 940, 1102, 1202) may be bonded to another bond