Conductive adhesive, method for manufacturing circuit connection structure, and circuit connection structure

The conductive adhesive contains an adhesive composition and conductive particles, and the conductive particles have a compressive hardness of 10.0 GPa or more at 25 DEG C and 3.5 GPa or less at 150 DEG C when compressed by 20%. 导电性黏合剂含有黏合剂组合物和导电粒子，导电粒子的压缩20％时的压缩硬度为在25℃下为10.0GPa以上，并且在150℃下为3.5GPa以下。...

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Bibliographische Detailangaben
Hauptverfasser:	ITO AKIHIRO, SUEYASU YUKA, KUDOU SUNAO, OOATARI, YUMIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The conductive adhesive contains an adhesive composition and conductive particles, and the conductive particles have a compressive hardness of 10.0 GPa or more at 25 DEG C and 3.5 GPa or less at 150 DEG C when compressed by 20%. 导电性黏合剂含有黏合剂组合物和导电粒子，导电粒子的压缩20％时的压缩硬度为在25℃下为10.0GPa以上，并且在150℃下为3.5GPa以下。