Tile type phased array module based on AIP packaging

The embodiment of the invention provides a tile type phased array module based on AIP packaging. The phased array module sequentially comprises a waveguide structure cavity, a control panel and an AIP packaging chip from bottom to top, wherein a waveguide hole penetrating through the waveguide structure cavity is formed in the center of the waveguide structure cavity; a rectangular groove is formed in the periphery of the opening of the waveguide hole; a rectangular fuzz button is arranged in the rectangular groove; a through opening is formed in the center of the control panel; the center of the lower surface of the AIP packaging chip is provided with a waveguide interface. And the rectangular fuzz button passes through the through opening in the center of the control panel and is connected with the waveguide interface in the center of the lower surface of the AIP packaging chip. According to the structure, the radio frequency signal and the power supply control signal can be separated on the control board,