W-band AIP package with frequency conversion module

The invention provides a W-band AIP package with a frequency conversion module. According to the method, a multifunctional chip, a power division chip, a packaging substrate and an antenna array are included; the antenna array is arranged on the top layer of the packaging substrate; the multifunctional chip and the power division chip are arranged on the bottom layer of the packaging substrate; the packaging substrate is internally provided with a first coaxial cable, a second coaxial cable and a radio frequency strip line. And the multifunctional chip is connected with the second class of coaxial through the first class of coaxial via the radio frequency strip line, and transmits signals to the antenna array. In this way, the manufacturing difficulty and cost of the mother board can be reduced, the signal loss can be reduced, the number of layers of the packaging substrate can be reduced, the cost can be reduced, the usability and testability can be improved, and a larger array plane can be conveniently form