Light emitting diode package with multiple test endpoints and parallel elements

The light-emitting diode packaging body with multiple test endpoints and parallel elements comprises a packaging carrier plate and first, second and third electrical test position contacts arranged on the packaging carrier plate, and the packaging carrier plate is provided with an upper element plan...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN FUBANG, LAI JUNMING, ZHANG ZHIQIANG, CAI ZENGGUANG, HUANG GUOXIN, HUANG CHANGQING, HUANG WENXING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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