Light emitting diode package with multiple test endpoints and parallel elements
The light-emitting diode packaging body with multiple test endpoints and parallel elements comprises a packaging carrier plate and first, second and third electrical test position contacts arranged on the packaging carrier plate, and the packaging carrier plate is provided with an upper element plan...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The light-emitting diode packaging body with multiple test endpoints and parallel elements comprises a packaging carrier plate and first, second and third electrical test position contacts arranged on the packaging carrier plate, and the packaging carrier plate is provided with an upper element plane and a lower bottom SMD (Surface Mount Device) electrode plane which are positioned on two sides. A first electrode and a second electrode of the main element and a first electrode and a second electrode of the auxiliary element are arranged on the side edge of the plane of the upper element, the first electrical testing position contact is electrically connected with the first electrode of the main element and the first electrode of the auxiliary element, and the second electrical testing position contact is electrically connected with the second electrode of the auxiliary element. The electrical test third position contact is electrically connected with the second electrode of the main element, so that the first |
---|