Polymer and application thereof

The present invention provides a polymer comprising a structure represented by formula (I): wherein the definitions of the variables are provided herein. By means of the polymer, the resin composition of the present invention can form a film having low haze and a low coefficient of thermal expansion...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHENG SIQI, LAI BAIHONG, SHI YUQIAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a polymer comprising a structure represented by formula (I): wherein the definitions of the variables are provided herein. By means of the polymer, the resin composition of the present invention can form a film having low haze and a low coefficient of thermal expansion. 本发明提供一种聚合物，其包含式(I)所示的结构：其中，各变量的定义提供于本文中。通过该聚合物，本发明的树脂组合物可形成低雾度且低热膨胀系数的膜。