Epoxy resin containing carbazole structure and preparation method and application thereof

The invention provides novel epoxy resin containing a carbazole structure as well as a preparation method and application of the novel epoxy resin. The epoxy resin has a structure as shown in a formula (1), wherein n is a natural number; r1 is a hydrogen atom, a halogen atom, an aliphatic group, a halogenated aliphatic group, an alkoxy group or a siloxy group; and R2 is a heterocyclic group, an aromatic ring group or an alicyclic group. The introduction of carbazole in the molecular chain of the epoxy resin can improve the heat and humidity resistance of the material, and the mechanical property of the epoxy resin can be greatly improved compared with that of the traditional bisphenol A epoxy resin. The novel epoxy resin containing the carbazole structure can be applied to the field of electronic packaging materials after being cured. 本发明提供一种含咔唑结构的新型环氧树脂及其制备方法和应用。环氧树脂具有如式(1)所示结构：其中，n为自然数；R1为氢原子、卤素原子、脂肪族基、卤代脂肪族基、烷氧基、硅氧基；R2为杂环基、芳环基、脂环基。本发明环氧树脂分子链中咔唑的引入能够改善材料的耐湿热性能，同时其力学性能较传统双酚A环氧树脂也能获得较大改善。所述含咔唑结构的新型环氧树脂固化后可适用电