Method for manufacturing circuit board with thick conductor and thin circuit

The invention discloses a manufacturing method of a thick-conductor fine-line circuit board. The manufacturing method comprises the following steps: providing a thick conductor; the thick conductor is subjected to laser etching, and according to the circuit pattern design of the thick conductor, part of unnecessary waste is subjected to laser cutting along the track of the single side edge of the circuit of the thick conductor to form a hollow area; a first bearing plate adheres to the thick conductor subjected to laser etching, a bonding area on the first bearing plate and a circuit pattern designed on the thick conductor are matched and supported, the first bearing plate is provided with a through area avoiding the circuit pattern designed on the thick conductor, and the through area does not coincide with the hollow area; and the thick conductor faces upwards and is subjected to laser etching again, the rest part on the thick conductor is subjected to laser cutting to form all the circuit patterns, and cut