Photosensitive component, preparation method thereof and camera module

The invention discloses a photosensitive component and a preparation method thereof, and a camera module, a chip electrical connection end of a photosensitive chip in the photosensitive component is provided with a second metal bonding layer, the second metal bonding layer is formed at the chip electrical connection end through a plating process, and the bonding strength between the second metal bonding layer and the chip electrical connection end is relatively high. The anti-interference performance is relatively high, so that the photosensitive chip is suitable for being moved in the assembling process of the photosensitive chip and the circuit board, the relative position relation between the photosensitive chip and the circuit board is kept by continuously moving the photosensitive chip, and then the assembling precision is improved to achieve electric conduction between the photosensitive chip and the circuit board. 公开了一种感光组件及其制备方法、摄像模组，其中，所述感光组件中感光芯片的芯片电连接端设置有第二金属结合层，且所述第二金属结合层通过镀设工艺形成于所述芯片电连接端，与芯片电连接端之