SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

A semiconductor package includes a substrate, a first semiconductor device disposed on the substrate at an offset position toward an edge of the substrate, and a ring structure disposed over the substrate and surrounding the first semiconductor device. The ring structure includes a cantilever portion suspended over an edge of the substrate. 本公开提供一种半导体封装包括衬底、以朝向衬底的边缘的偏移位置设置于衬底上的第一半导体器件以及设置在衬底之上并围绕第一半导体器件的环结构。环结构包括悬设于衬底的边缘之上的悬臂部。