Conductive paste and conductive film formed using same

The invention relates to a conductive paste and a conductive film formed using the same. The conductive paste contains a solder powder having a melting point of 120 DEG C or less, a conductive filler, a flux from which an oxide film of the solder powder is removed, and a solvent, and the mass of the...

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Bibliographische Detailangaben
Hauptverfasser:	OHASHI NAOMICHI, MATSUNO KOSO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The invention relates to a conductive paste and a conductive film formed using the same. The conductive paste contains a solder powder having a melting point of 120 DEG C or less, a conductive filler, a flux from which an oxide film of the solder powder is removed, and a solvent, and the mass of the conductive filler is 20-80% of the mass of the solder powder. 本发明涉及导电性糊剂及使用其形成的导电膜。导电性糊剂包含熔点为120℃以下的焊料粉、导电性填料、除去焊料粉的氧化膜的助焊剂、和溶剂，其中，所述导电性填料的质量相对于所述焊料粉的质量为20％～80％。