Method for reducing influence of environmental stress on performance of MEMS gyroscope

The invention discloses a method for reducing the influence of environmental stress on the performance of an MEMS (Micro Electro Mechanical System) gyroscope, which comprises the following steps of: during the design of an MEMS sensitive structure, leading out a leading-out end of the MEMS sensitive...

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Bibliographische Detailangaben
Hauptverfasser: JU LINA, ZHOU MING, WANG XIAOCHEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a method for reducing the influence of environmental stress on the performance of an MEMS (Micro Electro Mechanical System) gyroscope, which comprises the following steps of: during the design of an MEMS sensitive structure, leading out a leading-out end of the MEMS sensitive structure from the back surface of a substrate by adopting a TSV (Through Silicon Via) process; a cap is designed outside the MEMS sensitive structure on the front surface of the substrate; when the gyroscope is assembled, the cover cap of the MEMS sensitive structure is bonded on the substrate of the gyroscope. The leading-out end of the MEMS sensitive structure is led out from the back surface of the substrate, so that the MEMS sensitive structure can be reversely bonded during assembly, the cap of the MEMS sensitive structure is bonded during reverse bonding, the cap and a micro-mechanical structure in the MEMS sensitive structure are relatively isolated, and when the external environment changes, the cap can b