Bonding device and bonding method

A joining device is provided with: a pair of pressing members (20) that are disposed so as to face each other so as to sandwich a plurality of members to be joined (101, 102) from both sides in the stacking direction of the members to be joined (101, 102), and that are provided so as to be capable o...

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Bibliographische Detailangaben
Hauptverfasser:	FUKU HIDEHITO, OBATA TAKEHIRO, SATO HIROKI, MORIWAKI MOTONORI, UJIHIRA NAOKI, YAMAGUCHI KOJIRO, IWAMOTO TOMOYUKI, NAKAI MASANORI, MIYAMOTO TAKAYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A joining device is provided with: a pair of pressing members (20) that are disposed so as to face each other so as to sandwich a plurality of members to be joined (101, 102) from both sides in the stacking direction of the members to be joined (101, 102), and that are provided so as to be capable of pressing the members to be joined, and a plurality of power supply members (31, 32) that supply power to the members to be joined (101, 102) from both sides in the stacking direction of the members to be joined (101, 102); the plurality of power supply members (31, 32) are disposed on one side or both sides in the stacking direction of the plurality of members to be joined, and the plurality of power supply members (31, 32) are disposed so as to sandwich the pressurized portions (105) of the plurality of members to be joined pressurized by the pressurizing member therebetween, and are provided so as to be capable of supplying power to the members to be joined by coming into contact with the members to be joined.