Wafer edge temperature correction in batch thermal processing chamber

A process kit for use in a process chamber, the process kit comprising: an outer liner; an inner liner configured to be in fluid communication with a gas injection assembly and a gas discharge assembly of the processing chamber; the first annular reflector is arranged between the outer lining and the inner lining; a top plate and a bottom plate attached to an inner surface of the neck bush, the top plate and the bottom plate together with the neck bush forming a housing; a cassette disposed within the housing, the cassette including a plurality of shelves configured to hold a plurality of substrates thereon; and an edge temperature correction element disposed between the neck bush and the first annular reflector. 一种用于处理腔室中的处理套组，该处理套组包括：外衬套；内衬套，被配置为与处理腔室的气体注入组件及气体排放组件流体连通；第一环形反射器，设置在该外衬套与该内衬套之间；顶板及底板，附接于该内衬套的内表面，该顶板及底板与内衬套一起形成外壳；盒匣，设置在外壳之内，该盒匣包含被配置为在其上保持多个基板的多个搁架；及边缘温度校正元件，设置在该内衬套与第一环形反射器之间。