METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

A method for manufacturing an electronic component according to the present invention comprises: a preparation step for preparing an electrode forming body for an electronic component; and an electrode forming step for forming an electrode on the outer surface of the electrode forming body for the electronic component, in which a conductive resin layer is formed on the electrode forming body for the electronic component using a conductive resin composition containing a polysiloxane resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component, which has high moisture resistance, has few restrictions on design and manufacturing, and has high manufacturing efficiency. 本发明的电子部件的制造方法具有：准备工序，其准备电子部件用电极形成体；和电极形成工序，其在该电子部件用电极形成体的外表面上形成电极，在该电极形成工序中，使用含有聚硅氧烷树脂的导电性树脂组合物在该电子部件用电极形成体形成导电性树脂层。通过本发明，能够提供具有较高的耐湿性的电子部件的制造方法。或者，能够提供具有较高的耐湿性，并且设计上