Balanced welding of heterogeneous materials

A multi-layer welding procedure effective in resistance spot welding of heterogeneous materials is disclosed. The process may be repeated over a variety of grades/thicknesses and the number of sheets of conductive material, and may be performed with conventional welding tools and electrodes. Soldering surfaces of different sizes/different materials/different contact surface geometries are used to balance the thermal properties of the materials, the process is aimed at creating small, consistent intermetallic compounds (IMC) that effectively secure two different conductive materials together and have high strength, suitable for industrial mass production. A multi-layer resistance spot welding process pre-heats, welds, and cools a sample to control the formation of IMC formed therein. 公开了一种在异质材料电阻点焊中有效的多层焊接程序。该工艺可在多种等级/厚度和导电材料板材数量上重复进行，并且可以用传统的焊接工具和电极执行。不同尺寸/不同材料/不同接触面几何形状的焊接表面用于平衡材料的热特性，该工艺旨在创造小的、一致的金属间化合物(IMC)，IMC有效地将两种不同的导电材料固定在一起并具有高强度，适用于工业化批量生产。多层电阻点焊工艺对样品进行预加热、焊接和冷却，以控制其中形成的IMC的形成。