Semiconductor device including vertical finger contacts

A semiconductor device has a vertical finger contact formed in a substrate having a flexible side portion. Finger contacts are formed near one or more edges of the flexible side portion of the substrate. After a semiconductor die is mounted to and electrically coupled to the substrate, the semiconductor device may be encapsulated by placing the device in a mold sleeve including upper and lower templates. The lower template is smaller in size than the substrate such that the flexible side portion of the substrate containing the finger contacts is folded vertically upward to fit within the mold. 一种半导体装置具有形成在具有柔性的侧部分的衬底中的竖直指状触点。指状触点形成在所述衬底的所述柔性侧部分的一个或多个边缘附近。在将半导体裸片安装到且电耦合到所述衬底之后，可通过将所述装置放置在包含上部和下部模板的模套中来囊封所述半导体装置。所述下部模板的大小小于所述衬底，使得包含所述指状触点的所述衬底的所述柔性侧部分竖直向上折叠以装配在所述模具内。