Semiconductor device and semiconductor package

The invention relates to a semiconductor device and a semiconductor package. Embodiments of a semiconductor device may include a die coupled over a lead frame, a redistribution layer (RDL) coupled over the die, a first plurality of vias coupled between the RDL and the die, and a second plurality of vias coupled over the lead frame and directly coupled to the lead frame. The second plurality of vias may be adjacent an outer edge of the semiconductor device and may be electrically isolated from the die. 本申请涉及半导体器件和半导体封装。半导体器件的实施方式可包括耦接在引线框上方的管芯、耦接在该管芯上方的重新分布层(RDL)、耦接在该RDL和该管芯之间的第一多个通孔，以及耦接在该引线框上方并且直接耦接到该引线框的第二多个通孔。该第二多个通孔可以与该半导体器件的外边缘相邻，并且可以与该管芯电隔离。