SEMICONDUCTOR PACKAGE DEVICE

Disclosed is a semiconductor package device including: a semiconductor chip including a first chip pad and a second chip pad on an active surface of the semiconductor chip; and a redistribution substrate on the first die pad and the second die pad. The redistribution substrate includes a first redis...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JOO CHANG-EUN, LEE JAE-EAN, CHOI KYU-JIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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