SEMICONDUCTOR PACKAGE DEVICE

Disclosed is a semiconductor package device including: a semiconductor chip including a first chip pad and a second chip pad on an active surface of the semiconductor chip; and a redistribution substrate on the first die pad and the second die pad. The redistribution substrate includes a first redistribution pattern and a second redistribution pattern sequentially stacked on the active surface. The first redistribution pattern includes a first via portion and a first via pad portion vertically overlapping the first via portion. The second redistribution pattern includes a second via portion and a second via pad portion vertically overlapping the second via portion. The first via portion is in contact with the first die pad. The second via portion is in contact with the second die pad. And the length of the second through hole part is greater than that of the first through hole part. 公开了一种半导体封装器件，包括：半导体芯片，在所述半导体芯片的有源表面上包括第一芯片焊盘和第二芯片焊盘；以及在所述第一芯片焊盘和第二芯片焊盘上的再分布基板。所述再分布基板包括顺序堆叠在所述有源表面上的第一再分布图案和第二再分布图案。所述第一再分布图案包括第