Chemical grinding fluid formula applied to wafer back thinning

The invention discloses a chemical grinding fluid formula applied to wafer back thinning. The grinding fluid formula is composed of a grinding material, a builder, a lubricant, a composite dispersant, a composite surfactant, a chelating agent and water. The grinding fluid has the advantages that the grinding fluid has certain lubricating, cooling and anti-rust effects, is easy to clean after grinding, has good suspension performance and strong chelation capability on copper ions, and can greatly reduce the influence of the copper ions on the service life of the grinding fluid. 本发明公开了一种应用在晶圆背面减薄的化学研磨液配方，该研磨液配方由磨料、助洗剂、润滑剂、复合分散剂、复合表面活性剂、螯合剂以及水组成。本发明的优越性在于它具有一定的润滑、冷却、防锈作用，易于研磨后的清洗，悬浮性能好，对铜离子的螯合能力强，可以极大降低铜离子对研磨液使用寿命的影响。