Semiconductor device, packaging structure and preparation method thereof

A package structure includes a semiconductor die, a first insulating encapsulation, a plurality of first conductive features, an interconnect structure, and a bump structure. The semiconductor die includes a plurality of conductive pillars made of a first material. A first insulating encapsulation encapsulates the semiconductor die. A first conductive feature is disposed on the semiconductor die and electrically connected to the conductive pillar. The first conductive feature includes at least a second material different from the first material. An interconnect structure is disposed on the first conductive feature, wherein the interconnect structure includes a plurality of connection structures made of a second material. A bump structure electrically connects the first conductive feature to the connection structure, wherein the bump structure includes a third material different from the first material and the second material. 一种封装结构包括半导体管芯、第一绝缘包封体、多个第一导电特征、互连结构和凸块结构。半导体管芯包括由第一材料制成的多个导电柱。第一绝缘包封体包封半导体管芯。第一导电特征设