Substrate post-processing device
The invention discloses a substrate post-processing device, and the device comprises a driving mechanism which vertically clamps a wafer and drives the wafer to rotate; a supply arm which swings on the side surface of the wafer and supplies the liquid to the surface of the wafer through a nozzle the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a substrate post-processing device, and the device comprises a driving mechanism which vertically clamps a wafer and drives the wafer to rotate; a supply arm which swings on the side surface of the wafer and supplies the liquid to the surface of the wafer through a nozzle thereon; the check ring is arranged on the peripheral side of the driving mechanism; the surface of the check ring has a hydrophilic gradient to form a flow guide structure at the edge of the check ring, so that liquid thrown out by the wafer is guided to the lower part of the check ring through the flow guide structure.
本发明公开了一种基板后处理装置,其包括:驱动机构,其竖直夹持晶圆并带动晶圆旋转;供给臂,其在晶圆的侧面摆动并经由其上的喷嘴将液体供应至晶圆表面;挡圈,其设置于驱动机构的外周侧;所述挡圈表面具有亲水性梯度以在挡圈的边沿形成导流结构,使得晶圆甩出的液体经由导流结构导引至挡圈的下部。 |
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