Thin film deposition apparatus and thin film deposition method

Disclosed are a thin film deposition apparatus and a thin film deposition method, the thin film deposition apparatus comprising: a reaction vessel having a vacuum chamber, the reaction vessel being internally provided with a support capable of holding a substrate on a holding surface; the evaporatio...

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Bibliographische Detailangaben
Hauptverfasser:	JIANG YOUSONG, YANG YUN, WANG HUAIMIN, GU KANGXIN, ZHENG BINGWEI, DONG CHANGHAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Disclosed are a thin film deposition apparatus and a thin film deposition method, the thin film deposition apparatus comprising: a reaction vessel having a vacuum chamber, the reaction vessel being internally provided with a support capable of holding a substrate on a holding surface; the evaporation coating mechanism is arranged in the vacuum cavity and is used for carrying out evaporation coating on the substrate, and the evaporation coating mechanism is arranged towards the holding surface; the sputter coating mechanism is arranged in the vacuum cavity and used for carrying out sputter coating on the substrate, and the sputter coating mechanism is arranged towards the holding surface; wherein the evaporation coating mechanism and the sputter coating mechanism are positioned on the same side of the bracket; the minimum distance between the sputter coating mechanism and the support is smaller than 20 cm and larger than 5 cm. According to the thin film deposition device and the thin film deposition method, ev