Silicon carbide wafer single-side cleaning machine and silicon carbide wafer cleaning method

The invention relates to a silicon carbide wafer single-face cleaning machine and a silicon carbide wafer cleaning method. The silicon carbide wafer single-face cleaning machine comprises a cleaning tank, a rotating disc, a cloth pad and a cleaning fluid spraying mechanism, and the cleaning fluid sp...

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Hauptverfasser: ZHANG CHENG, CHEN YOUSHENG, LAI ZHANGTIAN, HE XIANHAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a silicon carbide wafer single-face cleaning machine and a silicon carbide wafer cleaning method. The silicon carbide wafer single-face cleaning machine comprises a cleaning tank, a rotating disc, a cloth pad and a cleaning fluid spraying mechanism, and the cleaning fluid spraying mechanism comprises a mixing box, an inverted-circular-truncated-cone-shaped transition pipe and a spraying head. According to the silicon carbide wafer single-side cleaning machine, a single fluid can be introduced for spraying cleaning, a two-fluid can also be adopted for carrying out single-side cleaning on the silicon carbide wafer after degumming cleaning, and the silicon carbide wafer single-side cleaning machine is especially suitable for cleaning large-area silicon carbide wafers of 8 inches or above, the cleaning effect is good, and the cleaning efficiency is high. According to the cleaning method of the silicon carbide wafer, the silicon carbide wafer subjected to degumming cleaning is subjected to