Pollutant identification measuring system, photoetching equipment and method thereof

An inspection system (1600), a lithographic apparatus, and an inspection method are provided. The inspection system (1600) includes an illumination system (1602), a detection system (1606), and a processing circuit (1622). The illumination system generates a first illumination beam (1610) at a first...

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Bibliographische Detailangaben
Hauptverfasser: PAWLOWSKI, MATTHEW, E, KREUZER JUSTIN L, KALLURI RAMESH C, JUDGE ANDREW, WALSH JAMES HARRY
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An inspection system (1600), a lithographic apparatus, and an inspection method are provided. The inspection system (1600) includes an illumination system (1602), a detection system (1606), and a processing circuit (1622). The illumination system generates a first illumination beam (1610) at a first wavelength and a second illumination beam (1618) at a second wavelength. The first wavelength is different from the second wavelength. The illumination system uses the first illumination beam and the second illumination beam to simultaneously irradiate the object (1612). The detection system receives radiation (1620) at a first wavelength scattered by particles (1624) present at a surface (1626) of an object. The detection system generates a detection signal. The processing circuit determines a characteristic of the particle based on the detection signal. 提供了检查系统(1600)、光刻设备和检查方法。检查系统(1600)包括照射系统(1602)、检测系统(1606)和处理电路(1622)。照射系统生成在第一波长下的第一照射束(1610)和在第二波长下的第二照射束(1618)。第一波长不同于第二波长。照射系统使用第一照射束和第二照射束来同时辐射物体(1612)。检测系统接