Automatic operation method for cap sealing of metal ceramic packaging power device

The invention provides an automatic cap sealing operation method for a metal ceramic packaging power device, and belongs to the technical field of chip packaging, and the method comprises the steps: S1, coating the end face of a cover plate with glue, and heating the cover plate to enable the glue to enter a curing phase and present a gel state; s2, the temperature of the lower die and the temperature of the upper die are adjusted to 100-180 DEG C; s3, the tube shell is installed on the lower die, and the cover plate coated with the glue is installed on the upper die; s4, the upper mold is driven to be located above the lower mold, and the gluing face of the cover plate faces the tube shell and is located over the tube shell; and S5, the lower mold and the upper mold are controlled to move oppositely till the cover plate makes contact with the tube shell, the gluing face of the cover plate is attached to the tube shell, and the condition is kept for 10-60 minutes. According to the automatic cap sealing operat