Integrated gate commutated thyristor component heat dissipation layout method based on force steering
The invention discloses an integrated gate commutated thyristor component heat dissipation layout method based on force steering. The method comprises the steps of pre-layout, determination of component layout, determination of whether to accept new layout, judgment of whether to reach a termination...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an integrated gate commutated thyristor component heat dissipation layout method based on force steering. The method comprises the steps of pre-layout, determination of component layout, determination of whether to accept new layout, judgment of whether to reach a termination condition, and output of optimal layout. Pre-layout is carried out according to the size of the multi-laminated PCB, iteration of offset is carried out on the initial positions of the components according to the heat flux gradient and the distance between the adjacent components, border crossing or component overlapping of the multi-laminated PCB is avoided in the moving process, a new layout is obtained, and according to the target function value and the relative error of the heat flux of the components of the two layouts, the optimal layout is obtained. And considering whether the new layout is accepted, judging whether a termination condition is reached on the basis of the new layout, and outputting the optimal |
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