Laminated structure heat insulation layer, preparation method and application

The invention provides a laminated structure heat insulation layer, a preparation method and application, the laminated structure heat insulation layer is formed by combining and pressing at least one rubber-based heat insulation layer and at least one resin-based aerogel layer, the compression stre...

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Bibliographische Detailangaben
Hauptverfasser: WEN YANWEI, WU ZHANWU, ZHAN GUOZHU, LOU YANG, ZUO HAILI, SHI YONGWEI, WANG ZHAOLIANG, MA WENXIU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a laminated structure heat insulation layer, a preparation method and application, the laminated structure heat insulation layer is formed by combining and pressing at least one rubber-based heat insulation layer and at least one resin-based aerogel layer, the compression strength of the resin-based aerogel layer is larger than or equal to 20 MPa, the compression modulus of the resin-based aerogel layer is larger than or equal to 70 MPa, and the thermal conductivity of the resin-based aerogel layer is 0.03 W/m.K-0. 04 W/m.K. The heat insulation layer with the laminated structure has good heat insulation (ablation resistance and scouring resistance) and heat insulation (low heat conduction) performance, compared with an existing heat insulation layer, on the basis that the original heat insulation performance is kept, more excellent heat insulation performance is further obtained, the heat conductivity of the existing heat insulation layer is reduced from 0.15 W/m.K to 0.25 W/m.K to 0.03