Semiconductor device

The embodiment of the invention relates to a semiconductor device. In order to reduce on-resistance in a semiconductor device for large current applications, the semiconductor device includes a source terminal lead located between a gate terminal lead and a Kelvin terminal lead in plan view and elec...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HATA TOSHIYUKI, OKUNISHI NORIKO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The embodiment of the invention relates to a semiconductor device. In order to reduce on-resistance in a semiconductor device for large current applications, the semiconductor device includes a source terminal lead located between a gate terminal lead and a Kelvin terminal lead in plan view and electrically connected with a source terminal via a plurality of conductive lines. 本公开的实施例涉及半导体器件。为了减小用于大电流应用的半导体器件中的导通电阻,半导体器件包括源极端子引线,该源极端子引线在平面图中位于栅极端子引线与开尔文端子引线之间并且经由多个导线与源极端子电连接。