Method for manufacturing resin molded material for sealing semiconductor, method for manufacturing semiconductor package, and method for manufacturing semiconductor device

Provided are a method for manufacturing a resin molded material for sealing a semiconductor, a method for manufacturing a semiconductor package, and a method for manufacturing a semiconductor device, with which it is possible to further reduce the content of conductive foreign matter. A method for m...

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Bibliographische Detailangaben
1. Verfasser:	URASAKI NAOYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are a method for manufacturing a resin molded material for sealing a semiconductor, a method for manufacturing a semiconductor package, and a method for manufacturing a semiconductor device, with which it is possible to further reduce the content of conductive foreign matter. A method for manufacturing a resin molded material for semiconductor sealing includes spraying and drying a mixture containing a thermosetting resin, a filler, and a solvent. 本发明提供一种能够进一步减少导电性异物的含量的半导体密封用树脂成形材的制造方法、半导体封装的制造方法及半导体装置的制造方法。半导体密封用树脂成形材的制造方法是喷雾含有热硬化性树脂、填料及溶媒的混合物并进行干燥。