Packaging structure and forming method of packaging structure

The invention discloses a packaging structure and a forming method thereof, and the structure comprises a first wafer which is provided with a first surface and a second surface which are opposite to each other; the passivation layer is fixed on the surface of the side wall of the first wafer and is provided with a third surface and a fourth surface which are opposite; a plurality of first connecting layers located in the passivation layer, wherein the first connecting layers penetrate through the passivation layer from the third surface to the fourth surface; a plurality of second connection layers in the first wafer, wherein the second connection layers penetrate through the passivation layer from the first surface to the second surface; the first device structure is positioned on the third surface of the passivation layer and is electrically connected with the first connecting layer; the second device structure is positioned on the first surface of the first wafer and is electrically connected with the sec