Packaging structure and forming method of packaging structure

The invention discloses a packaging structure and a forming method of the packaging structure, and the structure comprises a first wafer which is provided with a first surface and a second surface which are opposite to each other; the passivation layer is fixed on the surface of the side wall of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU ZAIFU, ZENG ZHAOKONG, GUO RUILIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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