Packaging structure and forming method of packaging structure

The invention discloses a packaging structure and a forming method of the packaging structure, and the structure comprises a first wafer which is provided with a first surface and a second surface which are opposite to each other; the passivation layer is fixed on the surface of the side wall of the first wafer and is provided with a third surface and a fourth surface which are opposite to each other; a plurality of first connecting layers located in the passivation layer, wherein the first connecting layers penetrate through the passivation layer from the third surface to the fourth surface; the first rewiring layer is positioned on the third surface of the passivation layer and is electrically connected with the first connecting layer; the second wafer is provided with a fifth surface and a sixth surface which are opposite to each other, and the fifth surface of the second wafer is fixed with the second surface of the first wafer; and forming a first welding layer on the first rewiring layer. The packaging