Semiconductor device including RC-IGBT

The invention relates to a semiconductor device including an RC-IGBT. A semiconductor device (100) is presented. In one embodiment, a semiconductor device includes a semiconductor substrate (102) including an RC-IGBT having a diode region (106). The diode region (106) includes a p-doped anode region...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DAINES MICHAEL, MAAS STEFFEN, SCHULZ HANS-JUERGEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a semiconductor device including an RC-IGBT. A semiconductor device (100) is presented. In one embodiment, a semiconductor device includes a semiconductor substrate (102) including an RC-IGBT having a diode region (106). The diode region (106) includes a p-doped anode region (112) and an n-doped emitter efficiency adjustment region (114). At least one of the anode region (112) or the n-doped emitter efficiency adjustment region (114) includes a deep level dopant (1181, 1182). 本发明涉及包括RC-IGBT的半导体器件。提出一种半导体器件(100)。半导体器件包括半导体衬底(102),该半导体衬底(102)包括具有二极管区域(106)的RC-IGBT。二极管区域(106)包括p掺杂阳极区(112)和n掺杂发射极效率调节区(114)。阳极区(112)或n掺杂发射极效率调节区(114)中的至少一个包括深能级掺杂剂(1181、1182)。