Ultrathin stainless steel band for electronic device and preparation method of ultrathin stainless steel band

The invention discloses an ultrathin stainless steel band for an electronic device and a preparation method of the ultrathin stainless steel band. The preparation method comprises the following steps that 1, a stainless steel band with the thickness of 3 +/-0.2 mm is placed in a twenty-high rolling...

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Hauptverfasser: BEN HAIFENG, YU YEHUA, ZHAO YI, QU FENG, XU XINYU, JIANG YIZHANG, WANG YONG, SHAN ZHAOHUI, JI NIWEI, YANG SHAOXU
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creator BEN HAIFENG
YU YEHUA
ZHAO YI
QU FENG
XU XINYU
JIANG YIZHANG
WANG YONG
SHAN ZHAOHUI
JI NIWEI
YANG SHAOXU
description The invention discloses an ultrathin stainless steel band for an electronic device and a preparation method of the ultrathin stainless steel band. The preparation method comprises the following steps that 1, a stainless steel band with the thickness of 3 +/-0.2 mm is placed in a twenty-high rolling mill, primary cold rolling is conducted under the assistance of a rolling agent A, and a stainless steel band A with the thickness of 1 +/-0.2 mm is obtained; 2, the stainless steel band A is subjected to primary annealing, secondary annealing and acid pickling, and a stainless steel band B is obtained; 3, the stainless steel band B is placed in a twenty-high rolling mill, secondary cold rolling is conducted under the assistance of the rolling agent B, and a stainless steel band C with the thickness ranging from 0.1 mm to 0.2 mm is obtained; 4, the stainless steel C is subjected to surface nitriding and electrolytic polishing, and a stainless steel band D is obtained; 5, the stainless steel band D is quenched and a
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The preparation method comprises the following steps that 1, a stainless steel band with the thickness of 3 +/-0.2 mm is placed in a twenty-high rolling mill, primary cold rolling is conducted under the assistance of a rolling agent A, and a stainless steel band A with the thickness of 1 +/-0.2 mm is obtained; 2, the stainless steel band A is subjected to primary annealing, secondary annealing and acid pickling, and a stainless steel band B is obtained; 3, the stainless steel band B is placed in a twenty-high rolling mill, secondary cold rolling is conducted under the assistance of the rolling agent B, and a stainless steel band C with the thickness ranging from 0.1 mm to 0.2 mm is obtained; 4, the stainless steel C is subjected to surface nitriding and electrolytic polishing, and a stainless steel band D is obtained; 5, the stainless steel band D is quenched and a</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FUELS
GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS
INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATINGCOMPOSITIONS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LUBRICANTS
LUBRICATING COMPOSITIONS
MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS
METALLURGY
METALLURGY OF IRON
MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS
PEAT
PETROLEUM, GAS OR COKE INDUSTRIES
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TECHNICAL GASES CONTAINING CARBON MONOXIDE
USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION
title Ultrathin stainless steel band for electronic device and preparation method of ultrathin stainless steel band
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