Ultrathin stainless steel band for electronic device and preparation method of ultrathin stainless steel band
The invention discloses an ultrathin stainless steel band for an electronic device and a preparation method of the ultrathin stainless steel band. The preparation method comprises the following steps that 1, a stainless steel band with the thickness of 3 +/-0.2 mm is placed in a twenty-high rolling...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses an ultrathin stainless steel band for an electronic device and a preparation method of the ultrathin stainless steel band. The preparation method comprises the following steps that 1, a stainless steel band with the thickness of 3 +/-0.2 mm is placed in a twenty-high rolling mill, primary cold rolling is conducted under the assistance of a rolling agent A, and a stainless steel band A with the thickness of 1 +/-0.2 mm is obtained; 2, the stainless steel band A is subjected to primary annealing, secondary annealing and acid pickling, and a stainless steel band B is obtained; 3, the stainless steel band B is placed in a twenty-high rolling mill, secondary cold rolling is conducted under the assistance of the rolling agent B, and a stainless steel band C with the thickness ranging from 0.1 mm to 0.2 mm is obtained; 4, the stainless steel C is subjected to surface nitriding and electrolytic polishing, and a stainless steel band D is obtained; 5, the stainless steel band D is quenched and a |
---|