Laser processing device

The present invention addresses the problem of obtaining a laser processing device that can sufficiently collect dust generated during processing and improve processing quality when drilling a substrate with laser light. The solution of the present invention is a laser processing device comprising: a laser unit that irradiates laser light from the front surface side of a workpiece to process the workpiece; a laser processing apparatus includes a laser unit configured to process a workpiece, and a moving table configured to move the workpiece and the laser unit relative to each other, and the laser processing apparatus includes a suction table configured to suck the workpiece provided on the moving table and provided with a hole having a pattern identical to that of a hole to be processed in the workpiece. 本发明的课题是目的在于得到一种激光加工装置，其在以激光对基板进行钻孔加工的情形中，可充分收集加工时所产生的粉尘，并使加工质量提升。本发明的解决方案是一种激光加工装置，其具有：激光单元，其为了加工工件而从所述工件的正面侧照射激光；以及移动台，其使所述工件与所述激光单元相对地移动，且所述激光加工装置中具备：吸附台，其吸附被设置于所述移动台上的所述工件，并设有与要在所述工件加工的孔的图案相同图案的孔。