Semiconductor device

A semiconductor device according to one embodiment includes: a semiconductor chip having a transistor and a drain pad provided on a substrate; a capacitor having an upper electrode and a lower electrode sandwiching the dielectric; a pad; and an empty pad provided on the substrate of the semiconductor chip. The semiconductor device is further provided with: a first lead connecting the pad and the drain pad of the semiconductor chip to each other; a second lead connecting the empty pad and an upper electrode of the capacitor to each other; and a third lead connecting the pad and the empty pad to each other. 一个实施方式的半导体装置具备：半导体芯片，具有设于基板上的晶体管和漏极焊盘；电容器，具有夹着电介质的上部电极和下部电极；焊盘；以及空焊盘，设于半导体芯片的基板上。该半导体装置还具备：第一引线，将焊盘与半导体芯片的漏极焊盘相互连接；第二引线，将空焊盘与电容器的上部电极相互连接；以及第三引线，将焊盘与空焊盘相互连接。