Integrated circuit, metalized structure of integrated circuit and manufacturing method of metalized structure

A metallization structure of an integrated circuit (IC) includes: an inter-metal dielectric (IMD) layer; a patterned metal layer embedded in the IMD layer; a patterned top metal layer disposed on the IMD layer; an electrical via including a via material passing through the IMD layer and connecting t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN GUANYU, WEI SHIZHAN, YANG QIHAN, CHEN LONGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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