Power module arrangement with improved thermal performance

There is provided a power module device (100) comprising, in order from a first main side (102) to a second main side (104): a substrate (110); an electrically insulating ceramic layer (120) on the substrate (110); an electrically insulating first insulating layer (130) on the ceramic layer (120), wherein the first insulating layer (130) comprises a prepreg material and has a layer thickness (d4) of less than 100 [mu] m; a conductive lead frame (140) on the first insulating layer (130), wherein the lead frame (140) is electrically insulated from the substrate (110); a power semiconductor device (150) on the lead frame (140); and an electrically insulating second insulating layer (160) on the power semiconductor device (150) such that the power semiconductor device (150) is embedded between the lead frame (140) and the second insulating layer (160). 提供一种功率模块装置(100)，从第一主侧(102)到第二主侧(104)依次包括：基板(110)；基板(110)上的电绝缘的陶瓷层(120)；陶瓷层(120)上的电绝缘的第一绝缘层(130)，其中第一绝缘层(130)包括预浸材料并且具有小于100μm的层厚度(d4)；第一绝缘层(130)上的导电引线框架(140)，其中引线框