Blind hole filling method without surface copper deposition

The invention belongs to the technical field of blind hole filling, and discloses a blind hole filling method without surface copper deposition, which can realize blind hole filling without surface copper deposition in a certain current density or voltage range by using electrochemical properties of electroplate liquid and simulating hole filling process parameters. The blind hole filling method without surface copper deposition comprises the steps that a blind hole plate is immersed in oil removing liquid; immersing the blind hole plate into an etching solution containing sodium persulfate and sulfuric acid; immersing the blind hole plate into sulfuric acid; and vertically putting the blind hole plate into the electroplating liquid as a cathode, putting an anode on the other side, and setting current or voltage parameters for electroplating. According to the method, the current density or voltage capable of achieving non-surface copper hole filling is determined through an electrochemical test, the hole fill