Packaging structure and packaging method of semiconductor device

The invention discloses a packaging structure and a packaging method of a semiconductor device. The packaging structure comprises a driving module and a power module which are oppositely arranged, the power module comprises a first packaging substrate and a power unit located on the side, facing the driving module, of the first packaging substrate. The driving module comprises a second packaging substrate and a driving unit located on the side, away from the power module, of the second packaging substrate. Wherein the second packaging substrate is provided with a connecting circuit, and the connecting circuit is at least used for connecting the power unit and the driving unit through a through hole penetrating through the second packaging substrate. According to the packaging structure, the loop parasitic inductance is reduced. 本发明公布了一种半导体器件的封装结构以及封装方法，所述封装结构包括：相对设置的驱动模块和功率模块；所述功率模块包括第一封装基板以及位于所述第一封装基板朝向所述驱动模块一侧的功率单元；所述驱动模块包括第二封装基板以及位于所述第二封装基板背离所述功率模块一侧的驱动单元；其中，所述第二封装基板具有连接电路，所述连接电路至少用于通过贯穿所述第二封装基板的通孔，连接所述功率单